Electrical Signal Crosstalk & Radiation Simulation Analysis of Precision Connectors
Signal Integrity (SI) analysis products for connectors are essential for designing high-speed serial channels, parallel buses, and comprehensive power delivery systems in modern high-speed electronic devices. These tools, which integrate electromagnetics (EM) and circuit simulation, enable the prediction of EMI/EMC, power integrity, and SI issues, thereby optimizing system performance prior to physical construction and testing. A leader in the development of high-frequency and high-speed connectors, Kyomori-Ka produces a wide range of ultra-precision connectors that deliver superior signal integrity solutions. During the development process, the company utilizes 3D electromagnetic simulation tools—such as CST STUDIO and HFSS—to verify compliance with requirements for millimeter-wave and ultra-high-speed transmission, and provides various simulation data tailored to customer specifications.
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*3D Electromagnetic Field Simulation
Precise 3D models containing high-frequency connector data can be provided. Furthermore, the connector's shielding performance is verified by observing the spatial propagation and distribution of the magnetic field, enabling an understanding of near-field and far-field EMC conditions during the early stages of electronic product development.
*2D/2.5D Electromagnetic Field Analysis
The example presents a connector and PCB layout that comply with transmission standards. By considering the installed components and the effects of signal trace reflections and crosstalk noise, the design achieves both standards compliance and an optimized PCB layout around the connector. Furthermore, by integrating the overall PCB layout and verifying the identification and mitigation of power supply noise, it is possible to precisely analyze the power-to-ground impedance and the distribution of electric field strength.
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By importing PCB CAD data, the entire PCB—including net and component information—can be analyzed, and the characteristics of connector solder joints can be reproduced.
PCB CAD Tools:
*OrCAD (INNOTECH Corp.)
・PCB design
・Conversion of PCB CAD data into analysis models
*SIwave (ANSYS Inc.)
ADS (Keysight Technologies, Inc.)
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*System Analysis
SIwave and ADS combine all elements between components into a single transmission circuit, ensuring the analysis results capture the characteristics of the entire system. This enables the verification of transmission characteristics—including the effects of equalization, noise, and jitter—across any data rate.
*Thermal Design
The effectiveness of heat sinks and thermal paths is verified by monitoring temperature rise during current flow.
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