Integrated Lasers Deliver High-value 1.6 Tbps Optics and Module Yields
适用于基于 DSP 的模块的 NewPhotonics NPG102 PIC TOC
The future of 1.6Tbps photonic integration is here! We are once again taking center stage with our advanced on-chip transmitter solutions—featuring monolithically integrated lasers—designed specifically for optical connectivity in data centers during the AI era.
As part of our all-optical innovation roadmap, the NPG102—designed for 1.6Tbps DSP-based modules—is accelerating the shift of data center infrastructure toward a future of low-latency, low-power connectivity. The NPG102 series of on-chip transmitters expands our portfolio of data center transceiver solutions, building upon the LPO pluggable optical core products we launched in March.
"Global data centers are accelerating infrastructure upgrades to boost AI workload performance, and the entire value chain is seeking progressive solutions that enable faster, more energy-efficient data processing," said Doron Tal, Senior Vice President and General Manager of Optical Interconnect.
The newly released NPG102 PIC on-chip transmitter (TOC) is designed for DSP-based transceivers, offering the advantages of low power consumption and low latency. The demands placed on data center infrastructure by AI and High-Performance Computing (HPC) have heightened the urgency of transitioning optical signal processing to rapid, energy-efficient 1.6Tbps transmission. By integrating lasers and modulators, the NPG102 PIC delivers breakthrough performance for data center networking and computing.
Key features of the NPG102 PIC TOC for DSP-based modules include:
- Optimized flip-chip integrates eight-channel, auto-tuning laser
- 224Gbps PAM4 modulation, 1.6Tbps aggregated bandwidth, and electrical-to-optical transmission.
- Internal channel control and monitoring with in-package, on-chip temperature monitoring.
- Power consumption as low as 2.9W
Extending the advantages of integrated lasers to the upstream of the value chain.
Laser integration also benefits module OEM production. The design of the pluggable OSFP module increases system integration through wafer-level laser alignment and integrated direct modulation, thereby accelerating OEM manufacturing yield maturity and transceiver module time-to-market.
The NewPhotonics NPG102 PIC on-chip transmitter for DSP-based transceiver modules is available in our early access program and is expected to be available in Q2 2025.
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