0.5mm Pitch
HF81 Series
The HF81 series is an FPC connector developed to meet the demand for miniaturized backlights in LCD modules for smartphones and wearable devices. It features a horizontal ZIF mating design, a height of 1.0 mm, a 0.5 mm pitch, and an auto-lock mechanism, and is compatible with FPCs having a thickness of 0.3 mm. This product is widely used in smartphones.
Product Purpose:
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●Smartwatch |
●iPad Tablet |
●Mac Computer |
●Smart Set-Top Box TV App |
●Earbuds/Pods |
●iPhone Smartphone |
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●Smart Speaker Pod |
●UAV / Drone |
●Vehicle Equipment |
●Security Equipment |
●AGV/AMR |
●Motor Drive |
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●Variable Frequency Drive (VFD) |
●Radar, LiDAR |
●TCU/Gateway |
●Industrial Camera |
●CNCs/PLCs |
●Endoscope |
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●Industrial Sensors |
●Server |
●MRI/CT |
●Industrial Robots |
●Motor |
●Meter |
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●Car Charger |
●HUD Head-Up Display |
●IVI/Navigation |
●Monitor |
●Camera |
●Multifunction Printer |
Download:
Product Specifications
| Connector Shape | Socket |
PCB Mounting Method |
SMT |
|
Mounting Type |
RightAngle | Contact Direction | BottomContact |
|
Mating Pitch |
0.5mm | PCB Mounting Pitch | 0.5mm |
|
Number of Cores |
4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 16, 18, 20, 22, 24, 26, 30, 32, 34, 40, 45, 50 | Terminal Plating | Gold |
|
Coating Thickness |
0.1μm Min. |
Electrical Transmission Specifications |
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Transmission Speed (Reference Value) |
10.0 Gbps |
Body Length (In the Direction of the Pitch) |
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|
Body Width (Longitudinal) |
3.8mm |
Body Height |
1.0mm |
|
Rated Voltage (AC) |
50 V |
Rated Voltage (DC) |
50 V |
|
Rated Current |
0.5A |
Withstand Voltage Rating |
200 V（AC） |
|
Impedance Matching |
100 Ω |
Contact Impedance |
40 mΩ Max. |
|
Maximum Operating Temperature Range |
105 ℃ |
Operating Temperature Range (Min.) |
-55 ℃ |
|
Terminal Arrangement |
Sigle Row | RoHS2 | Yes |
|
Suitable for FPC/FFC Thickness |
0.3mm±0.02mm | Dual Contact Points | No |
|
Pillar of Product Positioning |
No |
Number of Plugs and Unplugs |
50 |
|
Locking Method |
Auto I-Lock |
Anti-Hair Loss Function |
Yes |
|
Packaging Format |
Emboss |
Package Quantity |
5000 PCS |
4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 16, 18, 20, 22, 24, 26, 30, 32, 34, 40, 45, 50
Product Order Coding Rules: HF81-XXS-0.5SH-XX
①Series Name
②Series Number
③Terminal Contact Configuration
④Product Core Count
⑤Contact Spacing
⑥Terminal Shape
⑦Product Packaging Specifications
HF
81
None: Standard Type H: Space-Saving Type
0.5mm
SH: SMT Horizontal Mounting Type
(50): Standard Product (5,000 Pieces Per Pack) (99): 500 Pieces Per Pack
Product Image |
Order Number |
Production Status |
3D Data Download |
Core Spacing [mm] |
Connection Method |
Product Height |
Width [mm] |
Number Of Cores |
Locking Mechanism |
Contact Position |
Operating Temperature Range (Max.) |
High-Speed Transmission |
Product Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
50 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
45 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
40 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
34 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
32 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
30 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
26 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
24 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
22 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
20 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
18 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
16 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
14 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
12 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
11 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
10 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
9 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
8 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
7 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
6 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
5 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
||
|
In Mass Production |
0.50 |
Horizontal Chimerism |
1.0 |
3.80 |
4 |
Back flip |
Upper and Lower Contact Points |
-55°C ~ +105°C |
10.0 Gbps |
HF81 |
Product Features
◆ Ultra-Low Profile, Space-Saving Connector With 0.5mm Pitch and 1.0mm Height
It features excellent impedance characteristics, enabling high-speed transmission.
Supports FPC/FFC cables with a thickness of 0.3mm, which is the standard thickness for 0.5mm pitch connectors.
(The moderate rigidity of the reinforcing plate prevents FPC deformation, thus avoiding problems during insertion and connection.)
◆ There is No Need to Set a Pattern Keep-Out Area at the Bottom of the Connector
The underside of the connector is covered with resin to prevent terminal exposure, thereby imposing no restrictions on circuit board trace routing.
Halogen-free; enhanced countermeasures against solder wicking.
The connector does not contain chlorine or bromine levels exceeding the standard limits.
Defined according to the IEC 61249-2-21 standard:
Br: 900 ppm or less; Cl: 900 ppm or less; Br + Cl: 1,500 ppm or less.
◆ Automatic Product Installation Mapping
Tape-and-reel packaging enables automated product installation.
Standard products come in reels of 5,000 pieces, though sample packs of 500 pieces per reel are also available.
An ultra-slim, 0.5mm-pitch dual-contact connector featuring both top and bottom contacts; the ability to use either contact point enhances design flexibility.
It features excellent impedance characteristics, enabling high-speed transmission.
It supports high-speed electrical signals compliant with standards such as eDP (ver. 1.3) and MIPI (D-PHY).
Delivery with the SLD actuator in the "on" state means that the actuator does not need to be switched on prior to operation.
The tapered guide rails at the opening of the product housing facilitate the insertion of FPC/FFC.
Supports FPC/FFC cables with a thickness of 0.3mm, which is the standard thickness for 0.5mm pitch connectors.
(The moderate rigidity of the reinforcing plate prevents FPC deformation, thus avoiding problems during insertion and connection.)
◆ There is No Need to Set a Pattern Keep-Out Area at the Bottom of the Connector
The underside of the connector is covered with resin to prevent terminal exposure, thereby imposing no restrictions on circuit board trace routing.
This allows for greater freedom in circuit board design.
Halogen-free; enhanced countermeasures against solder wicking.
The connector does not contain chlorine or bromine levels exceeding the standard limits.
Defined according to the IEC 61249-2-21 standard:
Br: 900 ppm or less; Cl: 900 ppm or less; Br + Cl: 1,500 ppm or less.
◆ Automatic Product Installation Mapping
Tape-and-reel packaging enables automated product installation.
Standard products come in reels of 5,000 pieces, though sample packs of 500 pieces per reel are also available.
Plating Specifications
| Coding | Contact part | End Section | Auxiliary Steel Plate | RoHS Directive | |||
| 01+ | Au | Au | Sn-Cu | Correspond | |||
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