HF61 Series

0.3mm Pitch

HF61 Series

The HF61 series is an ultra-compact, space-saving FPC/FFC connector developed to meet the miniaturization and multi-functionality requirements of electronic devices such as smartphones, DVCs (digital video cameras), and DSCs (digital video controllers). It is used for internal connections in electronic devices. To increase the FPC cable retention force, a special metal terminal structure and a flip-type brake are used, supporting high-speed electrical signal transmission. The open position conveys the braking effect. It has a 0.3mm pitch, two contacts (top and bottom), a height of 0.9mm, supports FPCs with a thickness of 0.2mm, and a mounting area width of 3.5mm.

Product Purpose:







●Smartwatch
●iPad
●Mac Computer
●Smart Set-top Box TV App
●Pods
●iPhone






●Smart Speaker Pod
●Drones
●Vehicle-mounted Equipment ●Security Equipment
●AGV/AMR
●Motor Drive






●Frequency Converter
●LiDAR (Light Detection and Ranging)
●TCU/Gateway
●TCU/Gateway
●CNCs/PLCs
●Endoscopy






●Industrial Sensors
●Server
●MRI/CT
●Industrial Robots
●Motor
●Meter






●Car Charger
●HUD (Head-Up Display)
●IVI/Navigation
●Monitor
●Camera
●Multifunction Printer

Product Specifications

Connector Shape Socket PCB Mounting Methods SMT
Connector Orientation RightAngle Contact Direction Top and Bottom contact
Pitch
0.3mm Solder Tail Pitch 0.6mm
Pin Counts 11,13,15,17,19,21,25,31,35,39,41,45,49,51,61 Contact Plating Gold
Plating Thickness
0.1 μm Min. Signal Transmission Speed
Transmission Speed (Reference value)

Length (Pitch Direction)
Width (Depth) 3.5mm Height
0.9mm
Rated Voltage (AC)
50 V Rated Voltage (DC)
50 V
Rated Current
AC/DC0.2 A Withstand Voltage
200 V(AC)
Impedance Matching

Contact Resistance
80 mΩ Max.
Operating Temperature Range (Max)
85 ℃ Operating Temperature Range (Min)
-40 ℃
Array Sigle Row RoHS2 Yes
Suitable for FPC/FFC Thickness
0.2mm±0.02mm 2-Point Contact No
Boss Locator No Durabilit 50
Locks
Auto I-Lock Card (FPC) Retention Mechanism Yes
Packaging Type
Emboss Packing Quantity
5000 PCS

Part Number Structure: HF61-XXS-0.3SHW-XX
①Series Name
②Series Number
③Contact Type
④Number of
Positions

⑤Contact
Pitch

⑥Mounting Type
⑦Packaging
HF 61 None:Standard Type H:Space-saving Type
11,13,15,17,19,21,25,31,35,39,41,45,49,51,61 0.3mm
SHW: SMT Horizontal Staggered Mount Type
(50): Standard product (5,000 pieces per pack) (99): 500 pieces per pack

Product Image
Order Number
Production Status
3D Data Download
Core Spacing [mm]
Connection Method
Product Height
Width [mm]
Number Of Cores
Locking Mechanism
Contact Position
Operating Temperature Range (Max.)
High-Speed Transmission
Product Series
HF61-61S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
61
Back Flip
Top and Bottom Contact
-55°C ~ +85°C
MIPI D-PHY, eDP1.3
HF61
HF61-51S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
51
Back Flip
Top and Bottom Contact
-55°C ~ +85°C
MIPI D-PHY, eDP1.3
HF61
HF61-49S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
49
Back Flip
Top and Bottom Contact
-55°C ~ +85°C
MIPI D-PHY, eDP1.3
HF61
HF61-45S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
45
Back Flip
Top and Bottom Contact
-55°C ~ +85°C
MIPI D-PHY, eDP1.3
HF61
HF61-41S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
41
Back Flip
Top and Bottom Contact
-55°C ~ +85°C
MIPI D-PHY, eDP1.3
HF61
HF61-39S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
39
Back Flip
Top and Bottom Contact
-55°C ~ +85°C
MIPI D-PHY, eDP1.3
HF61
HF61-35S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
35
Back Flip
Top and Bottom Contact
-55°C ~ +85°C
MIPI D-PHY, eDP1.3
HF61
HF61-31S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
31
Back Flip
Top and Bottom Contact
-55°C ~ +85°C
MIPI D-PHY, eDP1.3
HF61
HF61-25S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
25
Back Flip
Top and Bottom Contact
-55 °C ~ +85 °C
MIPI D-PHY, eDP1.3
HF61
HF61-21S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
21
Back Flip
Top and Bottom Contact
-55°C ~ +85°C
MIPI D-PHY, eDP1.3
HF61
HF61-19S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
19
Back Flip
Top and Bottom Contact
-55°C ~ +85 °C
MIPI D-PHY, eDP1.3
HF61
HF61-17S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
17
Back Flip
Top and Bottom Contact
-55°C ~ +85 °C
MIPI D-PHY, eDP1.3
HF61
HF61-15S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
15
Back Flip
Top and Bottom Contact
-55°C ~ +85 °C
MIPI D-PHY, eDP1.3
HF61
	 HF61-11S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
13
Back Flip
Top and Bottom Contact
-55°C ~ +85 °C
MIPI D-PHY, eDP1.3
HF61
HF61-11S-0.3SHW
Mass Production In Progress
0.30
Horizontal Mating
0.95
3.50
11
Back Flip
Top and Bottom Contact
-55°C ~ +85 °C
MIPI D-PHY, eDP1.3
HF61

Product Features

◆ Thin 0.3mm pitch top and bottom contact connector
The product can use either top or bottom contacts, increasing design flexibility.

◆ Reverse flip and unique terminal structure ensure FPC cable fixation.
The reverse flip and unique terminal structure significantly improve FPC fixation. FPC cable retention force (horizontal direction): approximately 2.5 times that of other companies' products.

◆ Supports high-speed transmission
Excellent impedance characteristics enable high-speed transmission.
Better transmission characteristics are achieved by using identical terminals (even-even or odd-odd terminals) as differential pairs.
Using identical terminals (even-even or odd-odd terminals) as a pair of differential terminals provides better transmission characteristics and complies with eDP (version 1.3) and MIPI (D-PHY) standards.
Supports eDP (version 1.3) and MIPI (D-PHY) standards.

◆ SLD unlocked delivery
The actuator is delivered in the unlocked state, so it is not necessary to open the actuator before operation.
No need to open the actuator before operation.

◆ Easy FPC Cable Insertion
The tapered guide rail at the product's housing opening allows for easy insertion of the FPC.

◆ Compatible with 0.2mm Thick FPC Cables
Supports 0.2mm thick FPCs, the standard thickness for 0.3mm pitch connectors.
(The moderate rigidity of the reinforcing plate prevents FPC cable deformation and avoids problems during insertion and mating.)

◆ No Pattern Restricted Area on Connector Bottom
The bottom surface of the connector is covered with resin, eliminating exposed terminals and allowing for unrestricted circuit board routing. This enables greater flexibility in circuit board design.

◆ RoHS Compliant
Halogen-Free
The chlorine or bromine content of the connector does not exceed standard values.
*Based on IEC 61249-2-21 definition
Br: below 900ppm, Cl: below 900ppm, Br+Cl: below 1,500ppm

◆ Supports Automated SMT Compatibility
Automated assembly is possible through tape and reel packaging. Standard products are 5000 pieces per reel, but 500 pieces per reel are also available. (The external shape of the embossed roll is 5000 pieces per roll).

Plating Specifications

Coding Contact Area Terminal Area Hold-down Tab RoHS Directive
01+ Au Au Sn-Cu Compliant
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