0.3mm Pitch
HF62 Series
The HF62 series is an FPC connector developed to meet the demands for thinner and smaller designs in the digital camera (DSC) market. It features a 0.3mm pitch, 1.0mm board height, and 3.2mm side width at the surface mount point (SMT).*Vertical width when the flip cover is locked: 3.5mm. Suitable for consumer electronics such as smartphones/tablets, wearable devices, laptops, audio equipment, and game consoles.
Product Purpose:
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●Smartwatch |
●ipad |
●Mac computer |
●Smart set-top box TV app |
●Pods |
●iPhone |
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●Smart Speaker Pod |
●Drones |
●Vehicle-mounted Equipment |
●Security Equipment |
●AGV/AMR |
●Motor Drive |
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●Frequency Converter |
●LiDAR (Light Detection and Ranging) |
●TCU/Gateway |
●TCU/Gateway |
●CNCs/PLCs |
●Endoscopy |
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●Industrial Sensors |
●Server |
●MRI/CT |
●Industrial Robots |
●Motor |
●Meter |
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●Car Charger |
●HUD (Head-Up Display) |
●IVI/Navigation |
●Monitor |
●Camera |
●Multifunction Printer |
Download:
Product Specifications
| Connector Shape | Socket |
Baseboard Installation Method |
SMT |
|
Installation Form |
RightAngle | Contact Direction | BottomContact |
|
Pitch of Mating Parts |
0.3mm | Baseboard Mounting Pitch | 0.6mm |
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Number of Cores |
13, 15, 17, 19, 21, 23, 25, 27, 29, 31, 33, 35, 37, 39, 41, 45, 51, 55, 57, 61, 71 | Terminal Plating | Gold |
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Coating Thickness |
0.1 μm Min. |
Electrical Transmission Specifications |
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Transmission Speed (Reference value) |
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Body Length (Split direction) |
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Body Width (Vertical) |
3.5mm |
Body Height |
1.0mm |
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Rated Voltage (AC) |
30 V |
Rated Voltage (DC) |
30 V |
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Rated Current |
AC/DC0.2 A |
Withstand Voltage Value |
200 V（AC） |
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Impedance Matching |
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Contact resistance |
80 mΩ Max. |
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Operating Temperature Range (Max) |
85 ℃ |
Operating temperature range (Min) |
-40 ℃ |
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Terminal Arrangement |
Sigle Row | RoHS2 | Yes |
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Suitable for FPC/FFC Thickness |
0.2mm±0.02mm | Double Contact Point | No |
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Product Positioning Pillar |
No |
Number of Plugs and Unplugs |
50 |
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Auto I-Lock |
Auto I-Lock |
Card Removal Prevention Function |
Yes |
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Packaging Form |
Emboss |
Packing Quantity |
5000 PCS |
Product Order Coding Rule: HF62-XXS-0. 3SH-XX
①Series Name
②Series Number
③Terminal Contact Type
④Product Core Count
⑤Contact Spacing
⑥Terminal Shape
⑦Product Packaging Specifications
HF
62
None:Standard type H: Space-saving Type
13, 15, 17, 19, 21, 23, 25, 27, 29, 31, 33, 35, 37, 39, 41, 45, 51, 55, 57, 61, 71
0.3mm
SH: SMT Horizontal Placement Type
(50): Standard product (5,000 pieces per pack) (99): 500 pieces per pack
Product Image |
Order Number |
Production Status |
3D Data Download |
Core Spacing [mm] |
Connection Method |
Product Height |
Width [mm] |
Number Of Cores |
Locking Mechanism |
Contact Position |
Operating Temperature Range (Max.) |
High-Speed Transmission |
Product Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
71 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
61 |
Front Flip |
Next Node |
-55 °C ~ +85 °C |
HF62 |
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|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
57 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
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|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
55 |
Front Flip |
Next Node |
-55 °C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
51 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
|||
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Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
45 |
Front Flip |
Next Node |
-55 °C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
41 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
39 |
Front Flip |
Next Node |
-55 °C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
37 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
35 |
Front Flip |
Next Node |
-55 °C ~ +85 °C |
HF62 |
|||
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Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
33 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
31 |
Front Flip |
Next Node |
-55 °C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
29 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
27 |
Front Flip |
Next Node |
-55 °C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
25 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
23 |
Front Flip |
Next Node |
-55 °C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
21 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
19 |
Front Flip |
Next Node |
-55 °C ~ +85 °C |
HF62 |
|||
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Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
17 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
|||
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Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
15 |
Front Flip |
Next Node |
-55 °C ~ +85 °C |
HF62 |
|||
|
Mass Production In Progress |
0.30 |
Horizontal Chimerism |
1.0 |
3.50 |
13 |
Front Flip |
Next Node |
-55°C ~ +85 °C |
HF62 |
Product Features
◆Ultra-thin 0.3mm pitch FPC connector
This connector features an ultra-thin design with a height of 1.0mm and an installation depth of 3.5mm.
◆Easy circuit board mounting
The connector's front and rear terminal pins are staggered for easy installation, with a pitch of 0.6mm.
0.6mm pitch facilitates installation.
◆No pattern on the connector bottom.
The bottom of the product is covered with resin to eliminate exposed terminals.
This means that circuit board routing is unrestricted.
This increases the freedom of circuit board design.
◆Excellent operability thanks to the SLD flip-lock (rotary one-touch) ZIF structure.
The SLD actuator's flip-lock (rotary one-touch) ZIF structure makes FPC connection operation simple and safe.
A distinct click sound is heard upon locking to prevent incomplete locking.The SLD actuator's flip-lock (rotary one-touch) ZIF structure makes FPC connection operation simple and safe.
◆Supports 0.2mm thick FPC cables
Supports 0.2mm thick FPC cables, the standard thickness for 0.3mm pitch connectors.
(The moderate rigidity of the reinforcing plate prevents FPC deformation and avoids problems during insertion and mating.)
◆Automatic Installation
Automatic installation is possible through tape and reel packaging. (5,000 pieces per reel)
◆RHOS Compliant
Halogen-Free
No chlorine or bromine exceeding standard limits is used in the connectors.
* Defined according to IEC 61249-2-21 standard
Br: 900 ppm or less, Cl: 900 ppm or less, Br + Cl: 1,500 ppm or less
Plating Specifications
| Coding | Contact Part | End and Tail | Auxiliary Steel Plate | RoHS Directive | |||
| 01+ | Au | Au | Sn-Cu |
Correspond |
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