Current Location:首页>>Product Information>>Micro Connectors>>Floating Board-to-Board Connector>>0.5mm Pitch

0.5mm Pitch

DF50B Series

In recent years, with the rapid development and popularization of smart cars and electric vehicles, people are paying increasing attention to ADAS (Advanced Driver Assistance Systems) and AD (Autonomous Driving) to prevent traffic accidents in order to achieve a more reliable and safer automotive society. Mobility Computers, IVI※2, LiDAR, and other in-vehicle devices construct high-capacity information communication systems, requiring connectors to have zero-latency, high-capacity, and high-speed data transmission capabilities. The DF50B series is a floating board-to-board connector that combines high-speed transmission performance with high reliability. While achieving 8Gbps high-speed transmission, this product can float ±1.2mm in the X and Y directions, significantly improving the mechanical and electrical characteristics of high-speed transmission that are difficult to improve with typical floating connectors. It is compatible with various high-speed standards such as PCIe Gen.1~Gen.4, MIPI D/C-PHY, SATA3.0, and USB3.1 Gen.1, and also supports USB3.1 Gen.2. It can accommodate mating heights from 8mm to 30mm, increasing design flexibility. It can withstand harsh high-temperature environments of up to 125℃ required by automotive equipment.

Product Purpose:


●Smartwatch	●iPad Tablet	●Mac Computer	●Smart Set-Top Box TV App	●Earbuds/Pods	●iPhone Smartphone

●Smart Speaker Pod	●UAV/Drone	●In-Vehicle Equipment	●Security Equipment	●AGV/AMR	●Motor Drive

●Frequency Converter	●Radar, LiDAR	●TCU/Gateway	●Industrial Camera	●CNCs/PLCs	●Endoscope

●Industrial Sensors	●Server	●MRI/CT	●Industrial Robots	●Motor	●Meter

●Car Charger	●HUD Head-Up Display	●IVI/Navigation	●Monitor	●Camera	●Multifunction Printer

Download:

Product Catalog Product Drawing 3D(igs/stp) Product Specifications Test Report(TR) Product Packaging Specifications RoHS Report

Product Specifications

Connector shape	Plug/Receptacle	Substrate Mounting Method	SMT/DIP
Chimeric Form	Vertical Fitting-Vertical Fitting,Vertical Fitting-Horizontal Fitting	Contact Orientation	Bottom Contact
Mating Pitch	0.5mm	PCB Mounting Pitch	0.5mm
Number of Cores	30、40、60、80、100、120、140 Cores	Terminal Plating	Gold
Coating Thickness	0.1 μm Min.	Electrical Transmission Specifications	PCIe Gen.1~Gen.4、MIPI D/C-PHY、SATA3.0、USB3.1 Gen.1
Transmission Speed (Reference Value)	8Gbps	Body Length (Pitch Direction)
Body Width (Longitudinal)	10.4mm	Fitting Height	8/10/15/18/20/25/30mm
Rated Voltage (AC)	50 V	Rated Voltage (DC)	50 V
Rated Current	0.5A/signal terminal 6.0A/power terminal	Withstand Voltage Rating	AC 200Vrms, 1min
Impedance Matching	100 Ω	Contact Impedance	80mΩ Max
Maximum Operating Temperature Range	125 ℃	Operating Temperature Range (Min.)	-55 ℃
Terminal Arrangement	Dual Row	RoHS2	Yes
Product Suction Cap	No	Product Uses Fire-Resistant Adhesive Tape for Attachment	No
Pillar of Product Positioning	No	Mating Cycles	50
Product Movement Volume (X)	±1.2mm	Product Movement Volume (X)	±1.2mm
Effective Chimeric Z-Length		Anti-Hair Loss Function	Yes
Packaging Format	Emboss	Package Quantity	1800 PCS

Product Order Coding Rules: DF50B-XX-XXP/4-0.5V-895

①Series Name

②Stacking Height By Type (mm):

③Number of Signal Terminals

④Connector Type

⑤Number of Power Terminals

⑥Contact Spacing

⑦Terminal Shape

⑧Packaging Type

DF50B

Plug-Side Value + Socket-Side Value
Variable Stacking Height Type (8-30mm)

30、40、60、80、

100、120、140

Cores

P: Dual-Row Plug
R: Dual-Row Socket

0.5mm

V: Straight SMT

(800): Standard Product,
[⑧=05]: Embossed Packaging (3,000 Pieces/Reel)
[⑧=10]: Embossed Packaging (4,000 Pieces/Reel)
(895): Embossed Packaging (1800 Pieces/Reel) (for Prototypes)

Product Features

◆This floating board-to-board connector is suitable for high-speed PCIe Gen.4 (16GT/s) and also supports USB 3.1 Gen.2. The characteristic impedance is targeted at 85Ω to 100Ω, supporting various high-speed transmission standards. Supported specifications include: PCIe Gen.1 2.5GT/s to Gen.4 16GT/s, USB 3.1 Gen.1/Gen.2, MIPI D/C-PHY, SATA 3.0, etc.

◆0.5mm pitch, ±1.2mm float in X and Y directions, ±1.5mm induced displacement in X and Y directions. This absorbs substrate misalignment and installation deviations. Long-term reliability is achieved by reducing stress at solder joints. This product significantly improves both electrical and mechanical characteristics.
◆Four dedicated power pins (6.0A each) can be configured in addition to the signal pins, depending on the rated current requirements.
◆Generally, substrate pitch varies due to cumulative tolerances, affecting the effective engagement length of connector contacts and thus transmission performance. The "DF50B series" features an optimized shape design considering transmission specifications, ensuring a substrate height tolerance of ±0.75mm while achieving high-speed transmission.
◆Automotive-grade, high-temperature resistant, manufactured in an IATF 16949 certified factory with an operating temperature range of -40℃ to +125℃. This high-temperature resistant product is suitable for automotive equipment such as ADAS and infotainment systems. This product is manufactured in an IATF 16949 certified factory.
◆RoHS compliant, halogen-free.
◆Terminal material: Copper alloy
◆Socket material: Heat-resistant resin
◆Operating temperature range: -40℃ to +125℃