High-Density Array Series Connectors
AMP Series High-Density Array Connector
Product Purpose:
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◆5G/LTE Wireless |
◆Remote PHY、MSO |
◆Phased/Digital Array Radar |
◆Test and Measuring Instruments |
◆Low Earth Orbit/Medium Earth Orbit Satellites |
◆Radio Frequency System Chip |
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Download:
Product Specifications
| Connector Shape | Plug/Socket | Baseboard Installation Method | BGA |
| Installation Form | Vertical Fit-vertical fit | Contact Direction | Bottom Contact |
| Spacing Between Fitting Parts | 0.635mm | Baseboard Mounting Spacing | 0.635mm |
| Number of Cores | 64 Cores，248 Cores | Terminal Electroplating | Gold |
| Coating Thickness |
10~30μm |
Electrical Transmission Specifications | |
| Transmission Speed (Reference Value) | Supports 32 Gbps NRZ/64 Gbps PAM4 | Body Length (Spacing Direction) |
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| Body Width (Vertical Direction) |
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Combination Height | 5mm,10mm,16mm |
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Rated Voltage（AC） |
200V | Rated Voltage（DC） |
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| Rated Current |
Power Supply Section：15.0A、Cummunication Number Section：1.54A |
Withstand Voltage Value |
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| Impedance Matching |
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Contact Resistance |
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| Operating Temperature Range (Max) | 125 ℃ | Operating Temperature Range (Min) | -55 ℃ |
| Terminal Arrangement | Dual Row | RoHS2 | Yes |
| Product Floating Design | NO | Dual Contact Points | No |
| Product Positioning Pillar | Yes | Number of Plugs and Unplugs | 500 |
| The Product Uses a Suction Cup Cap | NO | The Product Uses Fire-Retardant Adhesive Paper for Adhesion | Yes |
| Locking Method | Auto I-Lock | Card Anti-dislodgement Function | Yes |
| Packaging Form | Emboss | Number of Packages | 2000 PCS |
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Product Order Coding Rules：XXX-XXS-XXX-X-X-X-X-XX |
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| Product Series | Signal Terminal Pin Count | Product Height | Terminal Plating Specifications | Number of Power Terminal Pins | Solder Ball Composition Specifications | Are there positioning posts | Packaging Specifications |
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■ AMPS：Female； ■ AMPP：Male |
10, 40,(PER ROW) |
■ 015: 1.5mm; ■ 035: 3.5mm； ■ 065: 6.5mm； ■ 085: 8.5mm |
■ L：10µ gold in the contact area & matte tin at the terminal tail; ■ S：30µ gold in the contact area & matte tin at the tail; ■ H：30µ gold in the contact area & matte tin at the tail |
2、3、4、5(PER ROW)
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■ SM：Surface Mount ■TH：Through Hole |
■ A：No locating pin ■ B：Locating pin |
■ TR: Packaged in rolls ■ FR: Packaged in rolls |
Product Image |
Order Number |
Production Status |
Data Download |
Core Spacing [mm] |
Connection Method |
Fitting Height |
Width [mm] |
Number Of Cores |
Welding Fixing Plate |
Operating Temperature Range |
High-Speed Transmission |
Product Shape |
Product Series |
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Product Features
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These high-density, high-speed signal/power array with a 0.635 mm pitch can achieve 64 Gbps PAM4 speeds and feature rotating power blades to improve performance and simplify the branch area(BOR).
■First-class power and signal density. ■The power connector can rotate 90°,allowing it to receive heat evenly for uniform cooling, increasing current capacity and reducing congestion. ■Supports 64 Gbps PAM4 (32d Gbps NRZ). applications ■The open terminal design allows for flexible grounding and wiring. ■High-density multi-row design. ■Slim and lightweight design with 5mm and 10mm stacking heights; up to 16mm on the roadmap. ■There are a total of 4 or 8 power plugs; models with up to 10 plugs are under development. ■A total of 60 or 240 signal locations are available; model with more locations are under development. ■0.635mm signal spacing. ■Optional positioning pin. ■Standard solder pads are used for secure connections to the circuit board. ■Pin guide for blind insertion. |
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Plating Specifications
Code
Contact Area
Tail Area
RoHS Directive
01+
Au 10µ，Au 30µ，
Si 30µ; SI-Cu 30µ
Compliant