High-Density Array Series Connectors
AP Series High-density Array Connectors
*0.635 mm pitch open terminal array
*Performance up to 56Gbps NRZ/112Gbps PAM4
*Cost-optimal solution
*The assembly height is 10mm.
*Provides a total of 400 terminals; the process is planned to reach over 1,000 terminals.
*Data rates are compatible with PCIe® Gen5 and 100GbE.
Product Purpose:
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◆5G/LTE Wireless |
◆Remote PHY、MSO |
◆Phased/Digital Array Radar |
◆Test and Measuring Instruments |
◆Low Earth Orbit/Medium Earth Orbit Satellites |
◆Radio Frequency System Chip |
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Download:
Product Specifications
| Connector Shape | Plug/Socket | Baseboard Installation Method | BGA |
| Installation Form | Vertical fit-Vertical fit | Contact Direction | Bottom Contact |
| Spacing Between Fitting Parts | 0.635mm | Baseboard Mounting Spacing | 0.635mm |
| Number of Cores | 40~400 Cores | Terminal plating | Gold |
| Coating Thickness |
10~30μm |
Electrical Transmission Specifications | |
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Transmission Speed (Reference Value) |
Supports 56Gbps NRZ/112Gbps PAM4 | Body Length (Spacing Direction) |
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Body Width (Vertical Direction) |
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Combined Heitht | 5mm,10mm |
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Rated Voltage（AC） |
150V | Rated Voltage（DC） |
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| Rated Current |
1.2 A(4 Pins Powered) |
Withstand Voltage Value |
250 V（AC） |
| Impedance Matching | Contact Impedance |
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| Operating Temperature Range(Max) | 125 ℃ | Operating Temperature Range(Min） | -55 ℃ |
| Terminal Arrangement | Dual Row | RoHS2 | Yes |
| Product Floating Design | NO | Dual Contact Points | No |
| Product Positioning Pillar | Yes | Number of Plug-in/Plug-out Cycles | 500 |
| The Product uses a Suction Cup Cap | NO | The Product Uses Fire-Retardant Adhesive Paper for Adhesion. | Yes |
| Locking Method | Auto I-Lock | Card Anti-dislodgement Function | Yes |
| Packaging | Emboss | Number of Packages | 2000 PCS |
■ APS:
Female；
■ APP：Male
■ 015: 1.5mm;
■ 019: 1.9mm；
■ 065: 6.5mm；
■ 035: 3.5mm
■ L：10µ gold in contact area & matte tin at terminal tail;
■ S：30µ gold in the contact area & matte tin at the tail;
4 ROW
■ 0: No solder balls
■ 1: 63.0% Tin & 37.0% Lead
■ 2: 96.5% Tin, 3.0% Silver, and 0.5% Copper
■ A：No locating pin
■ B：Positioning pin
■ TR: Roll packaging
■ FR: Full roll quantity with roll packaging
Product Order Coding Rules：XXX-XXS-XXX-X-X-X-X-XX
Product Series
Product Chip Count
Product Height
Terminal Plating Specifications
Terminal Row Number
Solder Ball Composition Specifications
Are there Positioning Posts
Packaging Specifications
20, 40, 60, 100 (PER ROW)
Product Image |
Order Number |
Production Status |
Data Download |
Core Spacing [mm] |
Connection Method |
Fitting Height |
Width [mm] |
Number Of Cores |
Welding Fixing Plate |
Operating Temperature Range |
High-Speed Transmission |
Product Shape |
Product Series |
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Product Features
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◆Open pin field design realizes grounding, wiring flexibility and cost optimization, the ultimate performance solution.
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Plating Specifications
Encoding
Terminal contact area
Terminal tail area
RoHS Directive
01+
Au 10µ，Au 30µ，
Si 30µ; SI-Cu 30µ
Corresponding